Presented by: Michael D. Slessor, Ph.D., FormFactor, Inc.

Michael D. Slessor, Ph.D.

Chief Executive Officer
FormFactor, Incorporated

Probe in the Spotlight – enabling advanced packaging, chiplets, and heterogenous integration”


To offset the slowing of front-end-driven Moore’s Law and sustain the innovation trajectory that has fueled fifty-plus years of semiconductor industry growth, the development of advanced packaging is rapidly accelerating. As industry focus moves from front-end fab to post-fab integration, wafer probe is taking a prominent role in enabling a variety of advanced-packaging schemes like heterogenous integration of chiplets. This rise in prominence is being driven by two basic trends, one economic and one technical. On the economic front, surprisingly high pre-assembly chiplet yields are required for viable composite product yields, driving increased test fidelity and coverage. On the technical front, chiplet-to-chiplet interconnect structures are at least an order of magnitude denser than traditional flip-chip interconnect, driving a corresponding intensification in both probe pitch and probe count. As a consequence, advanced packaging is driving more probes, on more probe cards, with more challenging requirements for the wafer test community, pushing us into the spotlight previously occupied by our friends in the fab.


Michael D. Slessor has served as the Chief Executive Officer of FormFactor, Inc. since December 2014, and as a Director since October 2013. Mike served as President from October 2013 to December 27, 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from October 2012 to October 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from July 2008 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA-Tencor. Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.


Keynote Address #2 - Probe in the Spotlight
Live Q&A